Vapor Phase Solder Reflow

For projects requiring solder as attach method, vapor phase reflow can repeatedly and reliably establish electrical connections without subjecting components, substrate, or die to excess thermal reflow times or temperatures.

 

 
  Copyright 2006 - 2020 by Pin 1 Technology, Inc. | Privacy Policy | Login  
  Logo designed and created by Jeffery Smith: jasworks@mac.com  
  Website Solutions by E-Nor