Quick Turn Prototyping
If you are pressed for time to deliver prototypes, mockups, or samples, our facility can put together a small lot size if devices quickly, economically and within your time frame.

Build requirements

Using the standard process steps available, a rapid assembly process can be developed for your devices that will ensure the finished parts will be on their way back based on dead line requirements.

  • Dicing – wafer dicing or die supplied in waffle tray or on film.
  • 2nd optical inspection – commercial standard visual inspection.
  • Die attach – using snap cure epoxy.
  • Wire bond – high speed automatic thermosonic gold ball bonding.
  • Sealing – lid tack, B-Stage, open package with temporary lid or any specification.
  • Branding – laser mark, etch.
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