Pin 1 can provide high speed singulation of wafers, ceramic substrate, plastic encapsulated devices. Using various dicing blade composite materials, complete separation and singulation of hard, brittle, metallic, polymer compositions is completed cleanly and quickly. The singulation process utilizes de-ionized H2O for ESD control.

DICING

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17437 N 71st Drive

Suite B102

Glendale, AZ 85308