Whether wafers or any substrate are single or multi-device type, sorting and
plating are not a problem with our in-house semi-auto mass device de-mounter or Royce semi-auto pick and place shuttle.

Orientation and X Y location are kept intact during de-mounting so that device selection is done quickly and cleanly. Singulated die and substrates can be sorted into chip trays, gel packs or trays for optical inspection and sealed for shipment.

DIE SORT

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