Gold Ball Bonding
High speed automatic gold ball bonders lay down up to 11 wires per second of gold inter-connects between die and substrate.
Loop height, ball size, bonding parameters, ball and tail bond locations, and substrate pre-treatment are all optimized for each custom assembly project.
Hybrid Wedge Bonding
Al or Au room temperature or thermally elevated ultrasonic wedge bonding.
Applicable for flex circuits, COB, ceramic substrates, open cavity, silicon based substrates, an any custom design project.